Diamond Grinding Cup Wheel with Certifications Products

• Customization: Available
• Blade Type: Segmented
• Manufacturing Process: Sintered
• Model NO.: 105-230mm
• Application: Marble
• Product Name: Diamond Grinding Cup Wheel
• Size: 115mm
• Material: 65mn+Diamond
• Color: Customised
• Advantage: High Efficiency
• Certification: ISO9001 /MPa
• Usage: Concrete Marble Granite Brick Tile
• Type: Double Row
• Transport Package: Packing
• Specification: 105-230mm
• Trademark: Yaofeng
• Origin: China
• Production Capacity: 10000 Pieces / Day
• Package Size: 36.00cm * 27.00cm * 27.00cm
• Package Gross Weight: 1.500kg

Product Description

Product Description

Product Name	Diamond Grinding Cup Wheel
Material	diamond,metal
Color	customized
Size	105-230mm
Type	Single Row, Double Row, Turbo Type
Tooth NO.	8,9,10,12,18,20,24,26,36
Brand	Yaofeng
Used	grinding all types of stone,concerete,brick block,masonry

Diamond Grinding Wheels: Key Characteristics and Advantages

1. Unmatched Hardness and Wear Resistance
Diamond, the hardest known natural material with a Mohs hardness rating of 10, endows these wheels with superior cutting power. This hardness enables them to grind ultra-hard materials that dull or damage traditional wheels, such as:
Ceramics (alumina, zirconia)
Hardened steel and alloy steels
Semiconductors (silicon, germanium)
Composite materials (carbon fiber-reinforced polymers) 
The low wear rate of diamond grains also extends the wheel's lifespan significantly. A single diamond grinding wheel can replace dozens of conventional wheels in high-volume production, reducing tool replacement frequency and downtime.
2. High Precision and Surface Quality
Diamond grinding wheels deliver exceptional dimensional accuracy and smooth surface finishes, making them ideal for applications requiring tight tolerances. Their ability to maintain consistent grain sharpness minimizes material deformation and heat-induced damage, ensuring:
Surface roughness (Ra) values as low as 0.01 μm, suitable for optical components or semiconductor wafers.
Tight dimensional tolerances (±0.001 mm), critical for aerospace parts or medical devices.
Reduced post-grinding processing (e.g., polishing), lowering overall production costs.
3. Efficient Heat Dissipation
Diamond's high thermal conductivity (approximately 2,200 W/m·K) helps dissipate heat generated during grinding quickly. This reduces the risk of thermal damage, such as:
Cracking or warping in brittle materials like glass or ceramics.
Metallurgical changes (e.g., annealing) in heat-sensitive alloys.
Residue buildup on the wheel surface, which can degrade grinding performance over time. 
Efficient heat management also allows for higher grinding speeds, boosting productivity without compromising quality.